Bluetooth Module
NEU: PAN1326
- Communicates with BT Low Energy single mode devices
- Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
- Fully Qualified Bluetooth v4.0 EDR, FCC and IC listed, CE complied
- Dimensions: 9.0 mm x 9.5 mm x 1.8 mm (width x length x height)
- Operating Temperature Range: -20ºC to +70ºC
- Supply Voltage Range: 1.7 - 4.8 V
PAN1310
- HCI Bluetooth 2.0+EDR Modul ohne Antenne
- 11,6 x 8,7 x 1,8 mm
- Ultra Low Power Mode mit nur 80 µA
PAN1311
- Embedded Bluetooth 2.0+EDR Modul ohne Antenne
- 11,6 x 8,7 x 1,8mm
- SPP Profile integriert
- Ultra Low Power Mode mit nur 80µA
PAN1315
Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
Fully Qualified Bluetooth v2.1 EDR, FCC and IC listed, CE complied
Dimensions: 6.5 mm x 9.0 mm x 1.8 mm (width x length x height)
Operating Temperature Range: -20ºC to +70ºC
Supply Voltage Range: 1.7 - 4.8 V
Based upon TI’s CC2560
Profiles: SPP, HDP, Audio and others
PAN1321
- Embedded Bluetooth 2.0+EDR Modul mit Antenne
- 15,6 x 8,7 x 1,8mm
- SPP Profile integriert
- Ultra Low Power Mode mit nur 80µA
PAN1325
Best-in-class Bluetooth RF performance (Tx, Rx sensitivity, blocking)
Fully Qualified Bluetooth v2.1 EDR, FCC and IC listed, CE complied
Dimensions: 9.0 mm x 9.5 mm x 1.8 mm (width x length x height)
Operating Temperature Range: -20ºC to +70ºC
Supply Voltage Range: 1.7 - 4.8 V
Based upon TI’s CC2560
Profiles: SPP, HDP, Audio and others
PAN1455
- Complete Bluetooth 2.0 + EDR solution
- CE, FCC und IC Zulassung
- ohne Antenne
- Verfügbare Profile: SPP, GAP, SDAP und HDP
PAN1555
- Complete Bluetooth 2.0 + EDR solution
- Full product qualification (Bluetooth, CE, FCC, IC)
- Verfügbare Profile: GAP, SDAP, SPP und HDP
- CSR BlueCore6-ROM inside
- integrierte Antenne
